As multi-die integration and advanced packaging continue to evolve, electrical, thermal, and mechanical decisions can no longer be made in isolation. Early package-level design choices now directly impact system performance, reliability, and manufacturability.

This workshop focuses on connecting package-level EDA workflows with physics-based modeling and system validation — helping engineers reduce risk, shorten iteration cycles, and design with greater confidence.

Workshop Details:

📅 Date: Wednesday, April 8, 2026

🕙 Time: 10 a.m. – 4 p.m.

📍 Location: Oregon State University – Johnson Hall Room 221

💲 Cost: Complimentary (Lunch included)

👉 Register now – Seats are limited:

https://event-new.sw.siemens.com/website/94080/

What You’ll Gain:

✅ How early 3D package planning influences downstream thermal and reliability outcomes

✅ Practical methods for gaining thermal insight during electrical design

✅ Thermal transient testing fundamentals and structure function calibration

✅ Secure compact modeling (BCI-ROM) for transient and multi-die simulation

✅ Multi-scale cooling strategies from package to board to full system

✅ Engineering tradeoff exploration using physics-driven workflows

You’ll hear directly from Siemens EDA and Simulation experts, engage with regional industry participants, and participate in a collaborative discussion between academia and industry.

This event is ideal for package designers, thermal engineers, system architects, researchers, and students working across logic, RF, power, and system-level electronics.

🔒 Registration closes April 3 — we hope you can join us.

This event is hosted by the OSU Division of Research and Innovation Economic Development and Industry Relations office and the College of Engineering.