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CALSCALE:GREGORIAN
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CATEGORIES:Lecture or Presentation,Conference or Workshop
DESCRIPTION:As multi-die integration and advanced packaging continue to evo
 lve\, electrical\, thermal\, and mechanical decisions can no longer be made
  in isolation. Early package-level design choices now directly impact syste
 m performance\, reliability\, and manufacturability.\n\nThis workshop focus
 es on connecting package-level EDA workflows with physics-based modeling an
 d system validation — helping engineers reduce risk\, shorten iteration cyc
 les\, and design with greater confidence.\n\n \n\nWorkshop Details:\n\n📅 Da
 te: Wednesday\, April 8\, 2026\n\n🕙 Time: 10 a.m. – 4 p.m.\n\n📍 Location: O
 regon State University – Johnson Hall Room 221\n\n💲 Cost: Complimentary (Lu
 nch included)\n\n \n\n👉 Register now – Seats are limited:\n\n \n\nhttps://e
 vent-new.sw.siemens.com/website/94080/\n\n \n\n \n\nWhat You’ll Gain:\n\n✅ 
 How early 3D package planning influences downstream thermal and reliability
  outcomes\n\n✅ Practical methods for gaining thermal insight during electri
 cal design\n\n✅ Thermal transient testing fundamentals and structure functi
 on calibration\n\n✅ Secure compact modeling (BCI-ROM) for transient and mul
 ti-die simulation\n\n✅ Multi-scale cooling strategies from package to board
  to full system\n\n✅ Engineering tradeoff exploration using physics-driven 
 workflows\n\n \n\nYou’ll hear directly from Siemens EDA and Simulation expe
 rts\, engage with regional industry participants\, and participate in a col
 laborative discussion between academia and industry.\n\n \n\nThis event is 
 ideal for package designers\, thermal engineers\, system architects\, resea
 rchers\, and students working across logic\, RF\, power\, and system-level 
 electronics.\n\n \n\n🔒 Registration closes April 3 — we hope you can join u
 s.\n\n \n\nThis event is hosted by the OSU Division of Research and Innovat
 ion Economic Development and Industry Relations office and the College of E
 ngineering.
DTEND:20260408T230000Z
DTSTAMP:20260417T124035Z
DTSTART:20260408T170000Z
GEO:44.567783;-123.279253
LOCATION:Johnson Hall\, 221
SEQUENCE:0
SUMMARY:From Package Planning to Predictive System Validation - A Multi-Dom
 ain Semiconductor Engineering Workshop from Siemens
UID:tag:localist.com\,2008:EventInstance_52373849659258
URL:https://events.oregonstate.edu/event/from-package-planning-to-predictiv
 e-system-validation-a-multi-domain-semiconductor-engineering-workshop-from-
 siemens
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