A Chemistry Departmental Seminar ft. Dr. Ryan Mackiewicz (Intel)

Moore's Law has been a driving force for the tech industry for over 50 years. Despite predictions of its end, companies like Intel have continued to innovate and keep the law alive.  Advanced packaging technologies drive the latest growth initiatives in the industry. Intel has developed new technologies, including Embedded multi‐die interconnect bridge (EMIB) and Foveros 3D stacking, that form the framework for a system-on-package (SOP) in new products like the latest Meteor Lake processors. One promising future direction for 3D stacking is hybrid bonding, offering significant scaling advantages over current technologies.  However, the technology presents many challenges in terms of complexity and cost. This talk will focus on the enablers of hybrid bonding, the role of chemistry in its development, and the opportunities for chemistry research.

Dr. Ryan Mackiewicz is a native of western New York.  He attended Texas A&M University for graduate school and completed a Ph.D. in Inorganic Chemistry.  Straight out of graduate school, he joined Intel’s Portland Technology Development as part of the wet etch area.  He was the first engineer in the single wafer wet cleans area, where the team won an Intel Achievement Award, Intel’s highest internal award.  He became a Group Leader after introducing the second generation of single-wafer tooling.  Recently, he moved to the advanced packaging area, becoming an early member of the Foveros Direct team in Wafer Assembly (WATD).  Since then, he has become the area manager of the hybrid bond assembly area.  He is a strong advocate of developing teams and career pathways. He believes in leading by empowering diverse groups and furthering Intel’s culture directive.  Outside of work, Ryan enjoys movies, running, and biking.