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PhD Final Exam – Lei Zheng

Modeling and Design of Interconnects and Passive Components for Millimeter-Wave Integrated Circuits in Silicon

For mmWave Integrated Circuit (IC) design, co-integration of passives can reduce size and power consumption, increase reliability, and reduce overall cost. However, skin and proximity effects in the metallization are aggravated at mmWave frequencies, resulting in increased attenuation and degradation of overall performance. Furthermore, tight integration of passive components (to reduce the die size) poses additional design challenges due to the complicated electromagnetic couplings between the components in close proximity. Other parasitic effects such as dummy metal fill parasitics and substrate eddy current loss, the impact of process variability and uncertainty are also more prominent at mmWave frequencies.

In this thesis, scalable compact modeling techniques based on the Principle of Electromagnetic Similitude and additionally developed methods of complexity reduction are presented. Scalable and compact equivalent circuit models for on-chip microstrip and Coplanar Waveguide (CPW) are developed and validated by both electro-magnetic (EM) simulations and on-wafer measurements. Furthermore, a more general field-based scalable modeling approach for multi-conductor interconnects (e.g., coupled CPWs) and more complicated passives is presented. The field-based approach has been applied and validated for modeling mmWave inductors, including the impact of metal fills and substrate eddy-current effects. Scalable models to capture the magnetic coupling between spiral inductors are presented and a compact layout strategy for reduction of magnetic coupling is proposed. The scalable and compact models include multi-physics effects such as temperature dependency and can also be utilized to  study the impact of the process variations efficiently.

Major Advisor: Andreas Weisshaar
Committee: Arun Natarajan
Committee: Karti Mayaram
Committee: Gabor Temes
GCR: John Parmigiani

Wednesday, August 1, 2018 at 2:00pm to 4:00pm

Kelley Engineering Center, 3057
110 SW Park Terrace, Corvallis, OR 97331

Event Type

Lecture or Presentation

Event Topic

Research

Organization
College of Engineering, Electrical Engineering and Computer Science
Contact Name

Calvin Hughes

Contact Email

Calvin.Hughes@oregonstate.edu

Contact Phone

5417373168

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